Our design group utilizes toolsets from Cadence, Mentor PADS, Autodesk, PTC , and many others. These toolsets allow us to utilize engineering constraint driven design for High Speed Signal Integrity, Controlled Impedance, High Current Thick Copper (5 to 30 Oz.) and other exotic constraints.

Utilizing our CAM / CIM system we can accelerate time to manufacturing by transferring data from the design flow directly to the CAM manufacturing flow. This dramatically reduces programming time and allows us to perform constraint driven DFM and BOM reconciliation to verify data integrity before it ever reaches manufacturing.

Service Offerings:
PCB Design and Advanced Packaging (COB, MCM, Thick Film Hybrids)
Flexibility of choice with several EDA toolsets available and the staff to use them:
Cadence Allegro PCB Expert
Pads PowerPCB
PCAD
OrCAD Capture
Engineering Constraint Driven Design:
High Speed Signal Integrity
Controlled impedance
High Current Thick Copper (5 to 30 Oz.
Single Double or Multi-Layer layouts, High Density, SMT, Thru-Hole or Both
Optimal Panelization for Manufacturing any Cost
Mechanical Enclosure Design:
Plastics
Sheet metal
Metal castings
CAM / CIM Toolset for:
BOM Validation
CAD Driven Documentation
Manufacturing Equipment Programming